High-speed self-similar debonding of an interface between two orthotropic materials: The anti-plane shear case

by Yue-Sheng, Wang; Zi-Mao, Zhang; Gui-Lan, Yu

The anti-plane problem of the transient debonding of an interface between two orthotropic materials is examined. The material principal axes are allowed to be oblique to the interface. The debonding is modeled as an interface crack propagating self-similarly from zero-length. The extending speed is assumed to be subsonic, transonic or supersonic. We first consider the dynamic debonding under the moving concentrated loading. The moving dislocation model of self-similar propagation of an interface crack is used to formulate the problem in a singular integral equation which is solved analytically. The stress singularity at the crack tips is discussed. The order of singularity is found to be one-half for subsonic debonding and to vary between zero and one-half depending on the crack speeds for transonic debonding. The dynamic stress intensity factors/coefficients for these two situations are presented in closed-form. The paper also concludes that supersonic debonding is impossible unless the loads are directly applied to the crack tips. Finally, the results for dynamic debonding under xn-type loads are presented by using the superposition method.

DOI: 10.1023/A:1007400728660
Print publication date: 9/1/1997
View article on SpringerLink

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